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11 results for “packaging”

SPIN Processed Press Release Frame: The Cushion

Karat Packaging Reports Second Quarter 2026 Financial Results

Karat Packaging reported second quarter 2026 financial results characterized by record sales and solid profitability, attributed to online growth.

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GlobeNewswire Technology

Aug 7, 2026

SPIN Processed Press Release Frame: none

Karat Packaging Board Increases Quarterly Cash Dividend

Karat Packaging, a distributor and manufacturer of disposable foodservice products, increased its quarterly cash dividend by $0.02 per share (4.4%) to $0.47 per share, payable August 28, 2026, to shareholders of record as of August 21, 2026.

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GlobeNewswire Technology

Aug 5, 2026

SPIN Processed News Frame: The Stampede

TSMC Develops AI Chip Packaging Tech to Counter Intel - The Information

TSMC announced development of new AI chip packaging technology aimed at competing with Intel's offerings, positioning itself as a strategic alternative in advanced semiconductor assembly.

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The Information AI via Google News

Jul 30, 2026

SPIN Processed News Frame: The Cushion

Nvidia signs a $1.5B accord with Amkor, involving a prepayment by Nvidia to help bolster Amkor's chip packaging facility in Arizona; AMKR jumps 16%+ after hours (Bloomberg)

Nvidia committed $1.5 billion in prepayment to Amkor Technology to expand its chip packaging capacity in Arizona, triggering a 16% after-hours stock surge for Amkor.

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Techmeme

Jul 24, 2026

SPIN Processed News Frame: The Cushion

More Intelligence for the Investment: Inside IDC’s New Packaging Model - IDC | Trusted Tech Intelligence

IDC has restructured its AI research offerings into tiered 'packaging models' to align pricing and deliverables with client investment levels, aiming to improve perceived ROI and adoption of its intelligence services.

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IDC AI via Google News

Jul 19, 2026

SPIN Processed News Frame: The Shield

Taiwan chipmaker planning to spend another $100B on US manufacturing expansion

TSMC announced a $100 billion expansion of U.S. semiconductor manufacturing capacity in Arizona, citing multiyear demand from leading U.S. customers as the driver.

Spin 84% Claim Present in Source AI Risk High
The Hill Technology

Jul 18, 2026

SPIN Processed News Frame: The Hype

Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging - Forbes

Cadence launched AuraStack, a new AI agent platform integrated into its electronic design automation (EDA) tools to automate PCB layout and advanced chip packaging workflows.

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Forbes AI / SaaS via Google News

Jul 16, 2026

SPIN Processed News Frame: The Shield

SpaceXAI’s Grok programming tool was uploading its users’ entire codebase to cloud storage

SpaceXAI's Grok Build CLI tool was found uploading users' entire codebases—including excluded files and historical secrets—to Google Cloud, prompting public disclosure and a reactive disablement of the feature.

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The Verge

Jul 15, 2026

SPIN Processed News Frame: The Stampede

A Taiwanese minister says TSMC plans two more advanced chip packaging plants in Chiayi Science Park, with all four expected to generate $9.35B+ in annual output (Wen-Yee Lee/Reuters)

TSMC announced plans to build two additional advanced chip packaging plants in Chiayi Science Park, bringing its total there to four, with projected combined annual output exceeding $9.35 billion.

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Techmeme

Jul 13, 2026

SPIN Processed News Frame: The Hype

Thoughts on this ?

A 14-year-old Manchester resident developed a computer vision system using YOLOv8 and trail cameras to detect illegal dumping (fly tipping), achieving 95% vehicle detection in early testing and aiming for automated council prosecution support.

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Reddit r/artificial

Published Jul 4, 2026 · Analyzed Jul 6, 2026

SPIN Processed Press Release Frame: The Shield

GPK Deadline: GPK Investors with Losses in Excess of $100K Have Opportunity to Lead Graphic Packaging Holding Company Securities Fraud Lawsuit

Graphic Packaging Holding Company investors may lead a securities fraud lawsuit due to alleged misrepresentations.

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PR Newswire Technology

Published Jul 2, 2026 · Analyzed Jul 5, 2026